【 Exhibition Date 】: August 23-25, 2023 Hall 1: 1L32
【 Exhibition Location 】: Hall 1, Shenzhen Exhibition Center (Futian)
【 Organizer 】: Bowen Creative Exhibition (Shenzhen) Co., Ltd
Guangdong Fenghua High tech Co., Ltd. (securities referred to as Fenghua High tech, securities code 000636) was established in 1984. It is a high-tech enterprise specializing in high-end new components, electronic materials and other electronic information basic products. It was listed on the Shenzhen Stock Exchange in 1996.
Exhibition Introduction:
From chip design to testing, from intelligent design to integration! High computing power, low power consumption, witnessing the impact of PPA empowering social intelligence!
ELEXCON 2023 will launch three new versions of the "Embedded Systems and AIoT Exhibition," "Vehicle Planning and Power Supply Exhibition," and "Semiconductor Advanced Packaging Exhibition." They will be unveiled at the Shenzhen Convention and Exhibition Center (Futian) from August 23rd to 25th. The exhibition scale of 60000 square meters is expected to attract more than 600 global high-quality brand manufacturers to gather on site, creating an innovative display, one-stop procurement, and technical exchange platform for the entire semiconductor industry chain. During the same period, we will also combine popular topics such as power devices and compound semiconductors, automotive grade chips, passive devices, embedded systems, SiP and advanced packaging, and set up characteristic exhibition areas, as well as more than 20 interactive activities such as peak forums and new product launches, to showcase global industry dynamics and future technological trends.
Display scope
Embedded Systems and AIoT Exhibition
·AI processor, MCU/MPU, DSP, RISC-V
·Analog chips, storage, modules, passive devices
·Wireless technology
·Open source hardware, industrial computer/board
·Operating system, software, and tools
Car regulations and power supply exhibition
·Third generation semiconductors, power semiconductors, passive devices
·PMIC/BMS, DCDC/ACDC
·Power module, connector, power test
·Energy storage technology
Semiconductor Advanced Packaging Exhibition
·3D IC design, EDA tools, IP
·Wafer Manufacturing and Wafer Level Packaging
·SiP and Advanced Packaging
·Chiplet technology
·Power device testing and MEMS testing
·Packaging materials/IC substrates
·Micro assembly and intelligent manufacturing
·OSAT service
