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The era of smartphones is gradually coming to an end and is moving towards the era of AI smartphones. 2024 can be seen as the first year of rapid development of mobile AI. Several well-known brands such as Samsung, Huawei, OPPO, Vivo, etc. have integrated AI technology into their flagship phones. According to data from market research firm Counterpoint, the shipment volume of generative artificial intelligence (AI) smartphones is expected to grow rapidly between 2023 and 2027. It is estimated that the shipment volume will account for 11% in 2024 and reach 550 million units by 2027, accounting for 43%, with an average annual compound growth rate of 49%.

 


AI smartphones have not only undergone deep integration at the software level, but also corresponding optimization and adaptation at the chip end.

 

The image is sourced from Qualcomm's official website

 

The Qualcomm 8750 platform (Snapdragon 8 Gen4), as Qualcomm's new generation flagship mobile processor, adopts advanced process technology (TSMC 3nm process) and self-developed CPU architecture (Nuvia Phoenix architecture), which provide powerful performance support in AI computing. The AI capabilities of Snapdragon 8 Gen4 will drive AI smartphones to achieve intelligent applications in more fields. For example, by optimizing camera functions through AI algorithms, more accurate object recognition, scene recognition, beauty optimization, and night scene shooting can be achieved; By optimizing mobile system resources through AI technology, more intelligent performance scheduling and energy-saving management can be achieved; By utilizing AI technology, more precise voice assistants and natural language processing functions can be achieved to enhance user interaction experience.

 

The image is sourced from within Sunlord

 

The upgrade of performance cannot be separated from the upgrade of hardware, and the power supply is a very important part of it. To improve AI performance, the Qualcomm 8750 platform has adjusted the nuclear power supply inductance to a value of 0.24uH for the first time, and proposed Isat to meet the high requirements of 6.5A&DCR<24mohm. Shunluo Electronics was the first to develop the material MWTC1412065SR24MTB02 suitable for the Qualcomm 8750 platform, and obtained Qualcomm testing certification, making it the first domestically produced product.

 


The following information has been published on the Qualcomm official website. Qualcomm customers can click on the link below to access it.

Platform

Vendor

LTCC

link

SM8750

Sunlord

MWTC1412065SR24MTB02

 

 

Characteristics of Sunlord MWTC1412065SR24MTB02 product

 

The Sunlord MWTC series power inductor adopts a new self-developed low loss high-performance material, combined with advanced molding synthesis technology, patented electrodes, complete backend detection equipment, etc., to help mobile phones achieve miniaturization and high reliability.

 

The image is sourced from within Sunlord

 


Small size design: With the development of smartphones towards lighter and thinner directions, the size requirements for internal components are also increasing. Shunluo's small-sized integrated power inductor can effectively save space and make mobile phone designs more compact. MWTC1412065SR24MTB02 adopts the mainstream size of 1.4 * 1.2 * 0.65mm on the flagship mobile platform, which is compact and high-performance.

High current resistance: Shunluo MWTC1412065SR24MTB02 integrated inductor can withstand high current impact, ensuring stable operation of mobile phone circuits, and is more suitable for high-density mounting and high-power circuit scenarios.

Low loss: The Shunluo small-sized integrated power inductor MWTC1412065SR24MTB02 is made of high-quality materials and advanced technology, with low loss characteristics, which helps improve the energy efficiency ratio of mobile phones and extend battery life.

Advanced technology: MWTC1412065SR24MTB02 adopts Shunluo's unique technology, which can shorten the production process, save costs, and at the same time, the solder pads are firm, not easy to fall off, and have good durability.

size model L/uH

RDC/mΩ(max)

Isat/A(max)
141208 MWTC141208SR24MT 0.24 24 6.5
MWTC141208SR33MT 0.33 27 5.2
MWTC141208SR47MT 0.47 32 4.0
  MWTC1412065SR24MTB02 0.24 23.5 6.8
MWTC1412065SR33MT 0.33 32 5.4
MWTC1412065SR47MT 0.47 41 3.0
MWTC1412065SR47MTB01 0.47 38 3.6

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